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bonding: fix multiple module load problem

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Some users still load bond module multiple times to create bonding
devices.  This accidentally was broken by a later patch about
the time sysfs was fixed.  According to Jay, it was broken
by:
   commit b8a9787edd
   Author: Jay Vosburgh <fubar@us.ibm.com>
   Date:   Fri Jun 13 18:12:04 2008 -0700

     bonding: Allow setting max_bonds to zero

Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.

Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
This commit is contained in:
Stephen Hemminger 2009-06-11 05:46:04 -07:00 committed by David S. Miller
parent 5ef12d98a1
commit 130aa61a77
1 changed files with 1 additions and 0 deletions
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1
drivers/net/bonding/bond_sysfs.c
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@ -1541,6 +1541,7 @@ int bond_create_sysfs(void)
printk(KERN_ERR
"network device named %s already exists in sysfs",
class_attr_bonding_masters.attr.name);
ret = 0;
}
return ret;