forked from luck/tmp_suning_uos_patched
thermal: update kernel-doc for thermal_zone_bind_cooling_device
This patch updates the documentation for thermal_zone_bind_cooling_device and removes the warnings generated by scripts/kernel-doc -v. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This commit is contained in:
parent
910cb1e34d
commit
d2e4eb83e7
|
@ -1109,13 +1109,23 @@ thermal_remove_hwmon_sysfs(struct thermal_zone_device *tz)
|
|||
#endif
|
||||
|
||||
/**
|
||||
* thermal_zone_bind_cooling_device - bind a cooling device to a thermal zone
|
||||
* @tz: thermal zone device
|
||||
* thermal_zone_bind_cooling_device() - bind a cooling device to a thermal zone
|
||||
* @tz: pointer to struct thermal_zone_device
|
||||
* @trip: indicates which trip point the cooling devices is
|
||||
* associated with in this thermal zone.
|
||||
* @cdev: thermal cooling device
|
||||
* @cdev: pointer to struct thermal_cooling_device
|
||||
* @upper: the Maximum cooling state for this trip point.
|
||||
* THERMAL_NO_LIMIT means no upper limit,
|
||||
* and the cooling device can be in max_state.
|
||||
* @lower: the Minimum cooling state can be used for this trip point.
|
||||
* THERMAL_NO_LIMIT means no lower limit,
|
||||
* and the cooling device can be in cooling state 0.
|
||||
*
|
||||
* This interface function bind a thermal cooling device to the certain trip
|
||||
* point of a thermal zone device.
|
||||
* This function is usually called in the thermal zone device .bind callback.
|
||||
*
|
||||
* Return: 0 on success, the proper error value otherwise.
|
||||
*/
|
||||
int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
|
||||
int trip,
|
||||
|
|
Loading…
Reference in New Issue
Block a user