Commit Graph

924 Commits

Author SHA1 Message Date
Sebastian Andrzej Siewior
7646ff2e7a thermal/x86 pkg temp: Convert to hotplug state machine
Install the callbacks via the state machine and let the core invoke
the callbacks on the already online CPUs.

Replace the wrmsr/rdmrs_on_cpu() calls in the hotplug callbacks as they are
guaranteed to be invoked on the incoming/outgoing cpu.

Signed-off-by: Sebastian Andrzej Siewior <bigeasy@linutronix.de>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:25:47 +08:00
Thomas Gleixner
556238e45c thermal/x86_pkg_temp: Sanitize package management
Packages are kept in a list, which must be searched over and over.

We can be smarter than that and just store the package pointers in an array
which is allocated at init time. Sizing of the array is determined from the
topology information. That makes the package search a simple array lookup.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:25:41 +08:00
Thomas Gleixner
411bb3835f thermal/x86_pkg_temp: Move work into package struct
Delayed work structs are held in a static percpu storage, which makes no
sense at all because work is strictly per package and we never schedule
more than one work per package.

Aside of that the work cancelation in the hotplug is broken when the work
is queued on the outgoing cpu and canceled. Nothing reschedules the work on
another online cpu in the package, so the interrupts stay disabled and the
work_scheduled flag stays active.

Move the delayed work struct into the package struct, which is the only
sensible place to have it.

To simplify the cancelation logic schedule the work always on the cpu which
is the target for the sysfs files. This is required so the cancelation
logic in the cpu offline path cancels only when the outgoing cpu is the
current target and reschedule the work when there is still a online
CPU in the package.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:25:34 +08:00
Thomas Gleixner
64ca738f1f thermal/x86_pkg_temp: Move work scheduled flag into package struct
Storage for a boolean information whether work is scheduled for a package
is kept in separate allocated storage, which is resized when the number of
detected packages grows.

With the proper locking in place this is a completely pointless exercise
because we can simply stick it into the per package struct.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:25:27 +08:00
Thomas Gleixner
ab47bd964a thermal/x86_pkg_temp: Sanitize locking
The work cancellation code, the thermal zone unregistering, the work code
and the interrupt notification function are racy against each other and
against cpu hotplug and module exit. The random locking sprinkeled all
over the place does not help anything and probably exists to make people
feel good. The resulting issues (mainly use after free) are probably
hard to trigger, but they clearly exist

Protect the package list with a spinlock so it can be accessed from the
interrupt notifier and also from the work function. The add/removal code in
the hotplug callbacks take the lock for list manipulation. That makes sure
that on removal neither the interrupt notifier nor the work function can
access the about to be freed package structure anymore.

The thermal zone unregistering is another trainwreck. It's not serialized
against the work function. So unregistering the zone device can race with
the work function and cause havoc.

Protect the thermal zone with a mutex, which is held in the work
function to make sure that the zone device is not being unregistered
concurrently.

To solve the module exit issues, we simply invoke the cpu offline callback
and let it work its magic. For that it's required to keep track of the
participating cpus in a package, because topology_core_mask is not affected
by calling the offline callback for teardown of the driver, so it would
never free the package as there is always a valid target in
topology_core_mask.

Use proper names for the locks so it's clear what they are for and add a
pile of comments to explain the protection rules.

It's amazing that fixing the locking and adding 30 lines of comments
explaining it still removes more lines than it adds.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:25:19 +08:00
Thomas Gleixner
8079a4bdcb thermal/x86_pkg_temp: Cleanup code some more
Coding style fixups and replacement of overly complex constructs and random
error codes instead of returning the real ones. This mess makes the eyes bleeding.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:25:13 +08:00
Thomas Gleixner
3883a64e38 thermal/x86_pkg_temp: Cleanup namespace
Any randomly chosen struct name is more descriptive than phy_dev_entry.

Rename the whole thing to struct pkg_device, which describes the content
reasonably well and use the same variable name throughout the code so it
gets readable. Rename the msr struct members as well.

No functional change.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:25:06 +08:00
Thomas Gleixner
b6badbea30 thermal/x86_pkg_temp: Get rid of ref counting
There is no point in the whole package data refcounting dance because
topology_core_cpumask tells us whether this is the last cpu in the
package. If yes, then the package can go, if not it stays. It's already
serialized via the hotplug code.

While at it rename the first_cpu member of the package structure to
cpu. The first has absolutely no meaning.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:24:59 +08:00
Thomas Gleixner
09a674cd69 thermal/x86_pkg_temp: Sanitize callback (de)initialization
The threshold callbacks are installed before the initialization of the
online cpus has succeeded and removed after the teardown has been
done. That's both wrong as callbacks might be invoked into a half
initialized or torn down state.

Move them to the proper places: Last in init() and first in exit().

While at it shorten the insane long and horrible named function names.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:24:53 +08:00
Thomas Gleixner
21a3d3d4c8 thermal/x86_pkg_temp: Replace open coded cpu search
find_next_sibling() iterates over the online cpus and searches for a cpu
with the same package id as the current cpu. This is a pointless exercise
as topology_core_cpumask() allows a simple cpumask search for an online cpu
on the same package.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:24:44 +08:00
Thomas Gleixner
89baa56be7 thermal/x86_pkg_temp: Remove redundant package search
In pkg_temp_thermal_device_remove() the package device is searched at the
beginning of the function. When the device refcount becomes zero another
search for the same device is conducted. Remove the pointless loop and use
the device pointer which was retrieved at the beginning of the function.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:24:38 +08:00
Thomas Gleixner
768bd13c93 thermal/x86_pkg_temp: Cleanup thermal interrupt handling
Wenn a package is removed nothing restores the thermal interrupt MSR so
the content will be stale when a CPU of that package becomes online again.

Aside of that the work function reenables interrupts before acknowledging
the current one, which is the wrong order to begin with.

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-30 10:24:20 +08:00
OGAWA Hirofumi
c6068a6edd thermal: intel_pch_thermal: Support skylake PCH 100 series thermal
This patch uses .driver_data and board_info[] to make per pci device
behavior table (name and ops), instead of adding the code for each pci
device in switch-case. This will make easier to add new pci device
ids.

Then this adds new device id actually for skylake PCH 100 series
(using registers are compatible with currently driver, so no need to
change except adding device id to table).

Signed-off-by: OGAWA Hirofumi <hirofumi@mail.parknet.co.jp>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23 10:05:52 +08:00
Jacob Pan
ec638db8cb thermal/powerclamp: add back module device table
Commit 3105f234e0 replaced module
cpu id table with a cpu feature check, which is logically correct.
But we need the module device table to allow module auto loading.

Cc: stable@vger.kernel.org # 4.8
Fixes:3105f234 thermal/powerclamp: correct cpu support check
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-21 20:54:40 +08:00
Eric Ernst
3105f234e0 thermal/powerclamp: correct cpu support check
Initial logic for checking CPU match resulted in OR of CPU features
rather than the intended AND.

Updated to use boot_cpu_has macro rather than x86_match_cpu.

In addition, MWAIT is the only required CPU feature for idle
injection to work.  Drop other feature requirements since they are
only needed for optimal efficiency.

CC: stable@vger.kernel.org #v4.7
Signed-off-by: Eric Ernst <eric.ernst@linux.intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-10-20 14:15:44 +08:00
Srinivas Pandruvada
33086a9a30 thermal: intel_pch_thermal: Enable Haswell PCH
Added missing support for Haswell PCH thermal sensor.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-10-20 14:15:44 +08:00
Srinivas Pandruvada
aed3f249f9 thermal: intel_pch_thermal: Add an ACPI passive trip
On the platforms which has an ACPI companion device associated with
PCH thermal device, read passive trip temperature via ACPI _PSV
control method.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-10-20 14:15:44 +08:00
Linus Torvalds
2d2474a194 Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal managament updates from Zhang Rui:

 - Enhance thermal "userspace" governor to export the reason when a
   thermal event is triggered and delivered to user space. From Srinivas
   Pandruvada

 - Introduce a single TSENS thermal driver for the different versions of
   the TSENS IP that exist, on different qcom msm/apq SoCs'. Support for
   msm8916, msm8960, msm8974 and msm8996 families is also added. From
   Rajendra Nayak

 - Introduce hardware-tracked trip points support to the device tree
   thermal sensor framework. The framework supports an arbitrary number
   of trip points. Whenever the current temperature is changed, the trip
   points immediately below and above the current temperature are found,
   driver callback is invoked to program the hardware to get notified
   when either of the two trip points are triggered. Hardware-tracked
   trip points support for rockchip thermal driver is also added at the
   same time. From Sascha Hauer, Caesar Wang

 - Introduce a new thermal driver, which enables TMU (Thermal Monitor
   Unit) on QorIQ platform. From Jia Hongtao

 - Introduce a new thermal driver for Maxim MAX77620. From Laxman
   Dewangan

 - Introduce a new thermal driver for Intel platforms using WhiskeyCove
   PMIC. From Bin Gao

 - Add mt2701 chip support to MTK thermal driver. From Dawei Chien

 - Enhance Tegra thermal driver to enable soctherm node and set
   "critical", "hot" trips, for Tegra124, Tegra132, Tegra210. From Wei
   Ni

 - Add resume support for tango thermal driver. From Marc Gonzalez

 - several small fixes and improvements for rockchip, qcom, imx, rcar,
   mtk thermal drivers and thermal core code. From Caesar Wang, Keerthy,
   Rocky Hao, Wei Yongjun, Peter Robinson, Bui Duc Phuc, Axel Lin, Hugh
   Kang

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (48 commits)
  thermal: int3403: Process trip change notification
  thermal: int340x: New Interface to read trip and notify
  thermal: user_space gov: Add additional information in uevent
  thermal: Enhance thermal_zone_device_update for events
  arm64: tegra: set hot trips for Tegra210
  arm64: tegra: set critical trips for Tegra210
  arm64: tegra: add soctherm node for Tegra210
  arm64: tegra: set hot trips for Tegra132
  arm64: tegra: set critical trips for Tegra132
  arm64: tegra: use tegra132-soctherm for Tegra132
  arm: tegra: set hot trips for Tegra124
  arm: tegra: set critical trips for Tegra124
  thermal: tegra: add hw-throttle for Tegra132
  thermal: tegra: add hw-throttle function
  of: Add bindings of hw throttle for Tegra soctherm
  thermal: mtk_thermal: Check return value of devm_thermal_zone_of_sensor_register
  thermal: Add Mediatek thermal driver for mt2701.
  dt-bindings: thermal: Add binding document for Mediatek thermal controller
  thermal: max77620: Add thermal driver for reporting junction temp
  thermal: max77620: Add DT binding doc for thermal driver
  ...
2016-10-12 11:05:23 -07:00
Srinivas Pandruvada
43720df960 thermal: int3403: Process trip change notification
When ACPI sends notification for trip point change re-read trips and
notify thermal core, so that this can be passed to user space thermal
controller.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:37:17 +08:00
Srinivas Pandruvada
9176ae8668 thermal: int340x: New Interface to read trip and notify
Separated the code for reading trip points from int340x_thermal_zone_add to
a standalone function int340x_thermal_read_trips. This standlone
interface to read is exported so that int340x drivers can re-read trips
on ACPI notification for trip point change.
Also the appropriate notification events are sent by int340x driver based
on the acpi event using int340x_thermal_zone_device_update().

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:37:14 +08:00
Srinivas Pandruvada
998d924b71 thermal: user_space gov: Add additional information in uevent
Add additional properties:
NAME= Thermal zone type
TEMP= Temperature sample value
TRIP= Violated trip index
EVENT= The notification event (new temperature sample, trip violation
trip changed)

This is the additional information to what kobject_uevent already
provides. So it will not impact existing user spaces.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:37:10 +08:00
Srinivas Pandruvada
0e70f466fb thermal: Enhance thermal_zone_device_update for events
Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:35:21 +08:00
Zhang Rui
040a3eadf0 Merge branches 'thermal-soc', 'thermal-core', 'thermal-intel' and 'thermal-tegra-hw-throttle' into next 2016-09-27 14:03:19 +08:00
Wei Ni
6c7c324570 thermal: tegra: add hw-throttle for Tegra132
Tegra132 use CCROC throttle registers to configure
pulse skiper, set these registers to enable throttle
function for Tegra132.

Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:32 +08:00
Wei Ni
ce0dbf04f6 thermal: tegra: add hw-throttle function
Tegra soctherm support HW throttle, when the soctherm snesors'
temperature is above the throttle trip point, it will trigger
pulse skiper to tune clocks accroding to the throttle depth.
Add this function for Tegra124 and Tegra210.
Since Tegra132 use different registers to configure pulse skiper,
will support it in next patch.

Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:32 +08:00
Axel Lin
1f6b0889d0 thermal: mtk_thermal: Check return value of devm_thermal_zone_of_sensor_register
devm_thermal_zone_of_sensor_register can fail, so check it's return value.

Signed-off-by: Axel Lin <axel.lin@ingics.com>
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
dawei.chien@mediatek.com
b7cf005373 thermal: Add Mediatek thermal driver for mt2701.
This patch adds support for mt2701 chip to mtk_thermal,
and integrate both mt8173 and mt2701 on the same driver.
MT8173 has four banks and five sensors, and MT2701 has
only one bank and three sensors.

Signed-off-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Laxman Dewangan
ec4664b3fd thermal: max77620: Add thermal driver for reporting junction temp
Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.

Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Marc Gonzalez
9dfe1a2f9a thermal: tango: add resume support
When this platform is suspended, firmware powers the entire SoC down,
except a few hardware blocks waiting for wakeup events. There is no
context to save for this particular block.

Therefore, there is nothing useful for the driver to do on suspend;
so we define a NULL suspend hook. On resume, the driver initializes
the block exactly as is done in the probe callback.

Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Reviewed-by: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Shawn Lin
e3da1cbed6 devfreq_cooling: no need to check state with negative number
We could see that state is defined as unsigned type, so it
should never be less than zero. Let' remove this check.

Signed-off-by: Shawn Lin <shawn.lin@rock-chips.com>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Bui Duc Phuc
d4b23c5c43 thermal: rcar_thermal: don't call thermal_zone_device_unregister when USE_OF_THERMAL
devm_thermal_zone_of_sensor_register() case doesn't need to call
thermal_zone_device_unregister().
Otherwise, rcar-thermal can't register thermal zone again after rebind.
This patch fixes it.

Signed-off-by: Bui Duc Phuc <bd-phuc@jinso.co.jp>
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Zhang Rui
7b5c4a0cd4 Thermal: of thermal: typo fix
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Peter Robinson
eea6a36439 thermal: imx: depend on imx SoC arch
Not much use unless the SoC is selected so depend on the ARCH_MXC
and COMPILE_TEST like all the other thermal drivers.

v2: drop extraneous OF

Signed-off-by: Peter Robinson <pbrobinson@gmail.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Wei Yongjun
809eb35045 thermal: qcom: tsens: Fix return value check in init_common()
In case of error, the function of_iomap() returns NULL pointer
not ERR_PTR(). The IS_ERR() test in the return value check
should be replaced with NULL test.
And the function devm_regmap_init_mmio() returns ERR_PTR()
and never returns NULL. The NULL test in the return value
check should be replaced with IS_ERR().

Signed-off-by: Wei Yongjun <weiyj.lk@gmail.com>
Acked-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Rocky Hao
5ef62de751 thermal: rockchip: optimize sensor auto accessing period
In less than 10 ms, the temperature of soc will arise 10 degree. 250 ms
is too big for soc tempeture control. Setting 2.5 ms will speed up
temperature accessing speed but introduce no more cpu's computing overhead.
We set AUTO_PERIOD_TIME and TSADCV3_AUTO_PERIOD_HT_TIME the same value,
because normal temperature update speed is also our consern in IPA.

Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Tested-by: Stephen Barber <smbarber@chromium.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Rocky Hao
23f75e4893 thermal: rockchip: enhance the tsadc's bandgap feature for rk3399
Due to the voltage ripple, the sensing data of the tsadc is not accurate.
And in this patch, the bandgap feature is enhanced to remove the voltage
ripple, and then the tsadc can sense the temperature more precisely.

Obsolete codes are removed as well.

Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Tested-by: Stephen Barber <smbarber@chromium.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Arnd Bergmann
5b97469a55 thermal: qcom: tsens-8916: mark PM functions __maybe_unused
The newly added tsens-8916 driver produces warnings when CONFIG_PM
is disabled:

drivers/thermal/qcom/tsens.c:53:12: error: 'tsens_resume' defined but not used [-Werror=unused-function]
 static int tsens_resume(struct device *dev)
            ^~~~~~~~~~~~
drivers/thermal/qcom/tsens.c:43:12: error: 'tsens_suspend' defined but not used [-Werror=unused-function]
 static int tsens_suspend(struct device *dev)
            ^~~~~~~~~~~~~

This marks both functions __maybe_unused to let the compiler
know that they might be used in other configurations, without
adding ugly #ifdef logic.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Jia Hongtao
43528445f6 thermal: qoriq: Add thermal management support
This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.

It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.

Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Kuninori Morimoto
64a411e804 thermal: rcar-thermal: enable hwmon when thermal_zone_of_sensor_register is used
rcar-thermal is supporting both thermal_zone_of_sensor_register() and
thermal_zone_device_register(). But thermal_zone_of_sensor_register()
doesn't enable hwmon as default.
This patch enables it to keep compatibility

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Keerthy
e2fa748809 thermal: of-thermal: Fix setting of set_emul_temp hook
Currently thermal zone set_emul_temp is set unconditionally
with of_thermal_set_emul_temp function. Set this only if the
set_emul_temp hook is provided for thermal_zone_of_device_ops.

This fixes emul_temp failures on platforms for which set_emul_temp
hook is not populated.

Fixes: "184a4bf623f (thermal: of: Extend current
	of-thermal.c code to allow setting emulated temp)"
Suggested-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Conflicts:
	drivers/thermal/of-thermal.c
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Caesar Wang
1f09ba82fa thermal: rockchip: fixes the exception interrupts
The hardware-tracked trips will set the alarm interrupt value for
registers. Then when the thermal zone has no trips to be set,
That make the thermal trips callback a over range value.

The root cause is the rk_tsadcv2_temp_to_code() function to handle the
invalid temperature range is indeed incorrect, let's fix it on now.
Otherwise, the thermal alarm interrupt will be triggered all the time
on some SoCs.

Fox example:
localhost tmp # grep thermal /proc/interrupts; sleep 5;
grep thermal /proc/interrupts

23:     994830  ..    GICv3 129 Level     rockchip_thermal
23:    1003423  ..    GICv3 129 Level     rockchip_thermal

Reported-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Caesar Wang
4666787906 thermal: rockchip: fixes the period time for tsadc
We should increase the period cycles to save power since the rk3399 has
the high frequency for tsadc clock.

Fixes commit b0d70338bc
("thermal: rockchip: Support the RK3399 SoCs in thermal driver")

Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Caesar Wang
148485023f thermal: rockchip: add the set_trips function
Whenever the current temperature is updated, the trip points immediately
below and above the current temperature are found. A sensor driver
callback `set_trips' is then called with the temperatures.
Lastly, The sensor will trigger the hardware high temperature interrupts
to increase the sampleing rate and throttle frequency to limit the
temperature rising When performing passive cooling.

Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Tested-by: Stephen Barber <smbarber@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Sascha Hauer
897e721037 thermal: bang-bang governor: act on lower trip boundary
With interrupt driven thermal zones we pass the lower and upper
temperature on which shall be acted, so in the governor we have to act on
the exact lower temperature to be consistent. Otherwise an interrupt maybe
generated on the exact lower temperature, but the bang bang governor does
not react since The polling driven zones have to be one step cooler before
the governor reacts.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Acked-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Sascha Hauer
e78eaf4599 thermal: streamline get_trend callbacks
The .get_trend callback in struct thermal_zone_device_ops has
the prototype:
        int (*get_trend) (struct thermal_zone_device *, int,
                          enum thermal_trend *);
whereas the .get_trend callback in struct thermal_zone_of_device_ops
has:
        int (*get_trend)(void *, long *);

Streamline both prototypes and add the trip argument to the OF callback
aswell and use enum thermal_trend * instead of an integer pointer.

While the OF prototype may be the better one, this should be decided at
framework level and not on OF level.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Sascha Hauer
826386e731 thermal: of: implement .set_trips for device tree thermal zones
This patch implements .set_trips for device tree thermal zones.
As the hardware-tracked trip points is supported by thermal core patch[0].

patch[0]
"thermal: Add support for hardware-tracked trip points".

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Sascha Hauer
060c034a97 thermal: Add support for hardware-tracked trip points
This adds support for hardware-tracked trip points to the device tree
thermal sensor framework.

The framework supports an arbitrary number of trip points. Whenever
the current temperature is updated, the trip points immediately
below and above the current temperature are found. A .set_trips
callback is then called with the temperatures. If there is no trip
point above or below the current temperature, the passed trip
temperature will be -INT_MAX or INT_MAX respectively. In this callback,
the driver should program the hardware such that it is notified
when either of these trip points are triggered. When a trip point
is triggered, the driver should call `thermal_zone_device_update'
for the respective thermal zone. This will cause the trip points
to be updated again.

If .set_trips is not implemented, the framework behaves as before.

This patch is based on an earlier version from Mikko Perttunen
<mikko.perttunen@kapsi.fi>

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Eduardo Valentin
032d405729 thermal: qcom: remove declare local symbols as static
Trivial: remove the following:
drivers/thermal/qcom/tsens-8916.c:103:24: warning: symbol 'ops_8916' was not declared. Should it be static?
drivers/thermal/qcom/tsens-8996.c:76:24: warning: symbol 'ops_8996' was not declared. Should it be static?
drivers/thermal/qcom/tsens-8974.c:235:24: warning: symbol 'ops_8974' was not declared. Should it be static?
drivers/thermal/qcom/tsens-8960.c:279:24: warning: symbol 'ops_8960' was not declared. Should it be static?

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Rajendra Nayak <rnayak@codeaurora.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Rajendra Nayak
d059c739aa thermal: qcom: tsens-8996: Add support for 8996 family of SoCs
The TSENS controller in 8996 family of SoCs is capable of converting the
ADC code outputs to real temperature values (in decidegree Celsius).
It can also be programmed to provide raw ADC code, but the secure software
on 8996 programs it to provide real temperatures and also does the needed
calibrations.

We check the valid bit to ensure valid data is read by the AHB master.
And the spec recommends the below algorithm to read data 3 consecutive
times, which takes care of the worst case delay taken to propagate the
updated data to the register.

Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Rajendra Nayak
20d4fd84bf thermal: qcom: tsens-8960: Add support for 8960 family of SoCs
8960 family of SoCs have the TSENS device as part of GCC, hence
the driver probes the virtual child device created by GCC and
uses the parent to extract all DT properties and reuses the GCC
regmap.

Also GCC/TSENS are part of a  domain thats not always ON.
Hence add .suspend and .resume hooks to save and restore some of
the inited register context.

Also 8960 family have some of the TSENS init sequence thats
required to be done by the HLOS driver (some later versions of TSENS
do not export these registers to non-secure world, and hence need
these initializations to be done by secure bootloaders)

8660 from the same family has just one sensor and hence some register
offset/layout differences which need special handling in the driver.

Based on the original code from Siddartha Mohanadoss, Stephen Boyd and
Narendran Rajan.

Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00