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kernel_optimize_test/Documentation/devicetree/bindings/interconnect
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Sibi Sankar c4877059e0 dt-bindings: interconnect: Add EPSS L3 DT binding on SM8250 
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SM8250
SoCs.

Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20200801123049.32398-5-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08 16:29:01 +03:00
..
fsl,imx8m-noc.yaml dt-bindings: Whitespace clean-ups in schema files 2020-08-14 08:55:58 -06:00
interconnect.txt dt-bindings: interconnect: Document the support of optional path tag 2020-09-08 16:28:58 +03:00
qcom,bcm-voter.yaml dt-bindings: interconnect: Add property to set BCM TCS wait behavior 2020-09-08 16:28:54 +03:00
qcom,msm8916.yaml dt-bindings: Clean-up schema indentation formatting 2020-04-16 16:59:22 -05:00
qcom,msm8974.yaml dt-bindings: Clean-up schema indentation formatting 2020-04-16 16:59:22 -05:00
qcom,osm-l3.yaml dt-bindings: interconnect: Add EPSS L3 DT binding on SM8250 2020-09-08 16:29:01 +03:00
qcom,qcs404.yaml dt-bindings: Clean-up schema indentation formatting 2020-04-16 16:59:22 -05:00
qcom,rpmh.yaml dt-bindings: interconnect: Add Qualcomm SM8250 DT bindings 2020-09-08 16:28:50 +03:00