kernel_optimize_test/include/dt-bindings/thermal
Krzysztof Kozlowski ca07ee4e3d thermal: exynos: Rename Samsung and Exynos to lowercase
Fix up inconsistent usage of upper and lowercase letters in "Samsung"
and "Exynos" names.

"SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked
names.  Therefore they should be written with lowercase letters starting
with capital letter.

The lowercase "Exynos" name is promoted by its manufacturer Samsung
Electronics Co., Ltd., in advertisement materials and on website.

Although advertisement materials usually use uppercase "SAMSUNG", the
lowercase version is used in all legal aspects (e.g. on Wikipedia and in
privacy/legal statements on
https://www.samsung.com/semiconductor/privacy-global/).

Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org
2020-01-27 10:24:32 +01:00
..
lm90.h
tegra124-soctherm.h of: Add bindings of gpu hw throttle for Tegra soctherm 2019-05-13 20:35:33 -07:00
tegra186-bpmp-thermal.h
tegra194-bpmp-thermal.h dt-bindings: thermal: tegra-bpmp: Add Tegra194 support 2018-11-27 18:41:23 +01:00
thermal_exynos.h thermal: exynos: Rename Samsung and Exynos to lowercase 2020-01-27 10:24:32 +01:00
thermal.h treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 498 2019-06-19 17:09:53 +02:00