forked from luck/tmp_suning_uos_patched
c48cbba6fe
This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
10 lines
268 B
Makefile
10 lines
268 B
Makefile
#
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# Makefile for sensor chip drivers.
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#
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obj-$(CONFIG_THERMAL) += thermal_sys.o
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obj-$(CONFIG_CPU_THERMAL) += cpu_cooling.o
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obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
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obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
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obj-$(CONFIG_EXYNOS_THERMAL) += exynos_thermal.o
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