forked from luck/tmp_suning_uos_patched
aa1acb0451
This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
21 lines
561 B
Makefile
21 lines
561 B
Makefile
#
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# Makefile for sensor chip drivers.
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#
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obj-$(CONFIG_THERMAL) += thermal_sys.o
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# governors
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obj-$(CONFIG_FAIR_SHARE) += fair_share.o
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obj-$(CONFIG_STEP_WISE) += step_wise.o
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obj-$(CONFIG_USER_SPACE) += user_space.o
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# cpufreq cooling
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obj-$(CONFIG_CPU_THERMAL) += cpu_cooling.o
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# platform thermal drivers
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obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
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obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
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obj-$(CONFIG_EXYNOS_THERMAL) += exynos_thermal.o
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obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
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obj-$(CONFIG_DB8500_CPUFREQ_COOLING) += db8500_cpufreq_cooling.o
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